Component Mounting Flexible Circuit Board (Component Mounting FPC)
Support for component mounting is also available.
This is an FPC with electronic components mounted.
- Company：スコットデザインシステム
- Price：Other
Flexible PCB(実装) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS
Last Updated： Aggregation Period:Apr 29, 2026～May 26, 2026
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Flexible PCB Product List
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Narrow pitch pad on beer flexible substrate
By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.
By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.
- Company：山下マテリアル
- Price：100,000 yen-500,000 yen
Double-sided flexible printed circuit board (double-sided FPC)
Double-sided type that allows for complex wiring.
This is an FPC with conductor patterns on both sides, allowing for complex wiring.
- Company：スコットデザインシステム
- Price：Other
Blind Via (BVH) connection Flexible Printed Circuit (FPC)
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Transparent flexible printed circuit board (transparent FPC)
A transparent flexible substrate with wiring that cannot be seen with the naked eye.
It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.
- Company：シライ電子工業 SPET事業部
- Price：Other
Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Stretchable flexible printed circuit board (FPC/flexible board)
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*
- Company：山下マテリアル
- Price：Other
Transparent flexible substrate
Ideal for wearable devices! Applicable to medical and smartphones, etc.
We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.
- Company：グロース
- Price：Other
Flexible circuit board
Flexible circuit board
Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A
- Company：ウェル
- Price：Other
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
High Current Flexible Circuit Board [*FPC Technology Catalog Available]
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
- Company：山下マテリアル
- Price：Other
Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
4-layer blind via flexible circuit board
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.
- Company：山下マテリアル
- Price：Other
Rigid Flexible Circuit Board (Rigid FPC)
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
- Company：スコットデザインシステム
- Price：Other
Flexible circuit board / Rigid-flexible circuit board
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
- Company：グレンエアジャパン
- Price：Other
Flying lead flexible printed circuit board (FPC/flexible circuit board)
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
Long-length flexible printed circuit board (FPC) for medical devices
For applications such as endoscopes, catheters, CT, and analytical devices! We introduce our flexible printed circuits (FPC) for medical devices.
We would like to introduce our "Long Flexible Printed Circuit Boards (FPC)" that we handle. We have a proven track record of achieving longer lengths by using crank and spiral shapes, and we can produce boards with lengths in the meter range and widths of less than 1mm. We are also capable of mounting 0402 size components. Additionally, we offer "Slit Flexible Printed Circuit Boards (FPC)" that can accommodate "twisting," as well as "Ultra-Fine Circuit Flexible Printed Circuit Boards (FPC)" that contribute to miniaturization and lightweighting of products through high-density design. 【Features of Long Flexible Printed Circuit Boards (FPC)】 ■ Capable of production in meter-class lengths ■ Capable of production with board widths of less than 1mm ■ Capable of mounting 0402 size components *For more details, please refer to the PDF document or feel free to contact us.
- Company：山下マテリアル
- Price：Other
Flexible printed circuit board (FPC) design, prototyping, small lot, impedance
Impedance control of flexible substrates and UL certification can be achieved with short lead times and the ability to manufacture small quantities.
We can respond to circuit board manufacturing and component mounting in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We also accommodate small lot production. Please feel free to consult with us.
- Company：アレイ
- Price：Other
High-frequency compatible flexible substrate (MPI specification)
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction
- Company：太洋テクノレックス 本社 和歌山
- Price：Other
Single-sided/Dual-sided flexible circuit board
By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.
We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.
- Company：松和産業 本社
- Price：Other
Flexible Printed Circuit (FPC) "Transparent FPC"
Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!
"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.
- Company： Oki Electric Cable Co., Ltd．
- Price：Other
High Current Compatible Flexible Circuit Board BigElec
The Big Elec flexible circuit board compatible with high current has three features.
Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.
- Company：山下マテリアル
- Price：100,000 yen-500,000 yen
High Current Compatible Flexible Circuit Board BigElec
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.
Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.
- Company：山下マテリアル
- Price：500,000 yen-1 million yen
What is SPET?
Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.
"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.
- Company：シライ電子工業 SPET事業部
- Price：Other
Flexible printed circuit board (FPC) short delivery time
Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.
We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.
- Company：アレイ
- Price：Other
High heat-resistant, low-loss LCP flexible substrate for data centers
Solving heat management and signal loss in high-density data centers.
In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions
- Company：山下マテリアル
- Price：Other
High heat-resistant, low-loss flexible substrate for displays
Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.
In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting
- Company：山下マテリアル
- Price：Other
High heat-resistant, low-loss flexible substrate for wearables
A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.
As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics
- Company：山下マテリアル
- Price：Other
High heat-resistant, low-loss flexible substrate for medical devices
Flexible substrates contributing to the miniaturization and high performance of precision medical devices.
In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments
- Company：山下マテリアル
- Price：Other
Search Keywords Related to Flexible PCB
Related Categories of Flexible PCB
- Printed Circuit Board
- substrate
- Control Board
- Circuit Board
- Ceramic Substrate
- Wiring Board
- Power Supply Board
- Multilayer Board
- Flexible Board
- Alumina Substrate
- Heat dissipation board
- Build-up Board
- Mounting board
- Universal Board
- Light Board
- Conversion Board
- To Board
- Measurement Board
- Single-sided board
- High Frequency Board
